View Mobile Heilind Electronics, Inc. (http://www.heilind.com) is one of the world’s leading distributors of connectors, relays, sensors, switches, thermal management and circuit protection products, terminal blocks, wire and cable, wiring accessories and insulation and identification products. IMAPS-UK will hold an Online Conference on the afternoons of Wednesday 25 November and Thursday 26 November 2020 on the topic of. Vadim Gektin, Member Technical Staff, NUVIA, Inc. Bill Maltz, President, Electronic Cooling Solutions, Inc. Nader Nikfar, Principal Thermal Engineer, Qualcomm Technologies, Inc. Adriana Rangel, Mechanical Engineer, Cisco Systems Inc. Dave Saums, Principal, DS&A LLC Tejas Shah, Senior Thermal Architect, Intel Corporation Guy Wagner, Director, Electronic Cooling Solutions, Inc. Ross Wilcoxon, Associate Director, Mechanical Engineering, Mission Systems, Collins Aerosace, Inc. Mobile and handheld devices: Wearables, mobile, medical devices, small displays, tablets, notebooks, AR headsets, and other consumer and mobile devices introduce unique component- and system-level thermal challenges that require novel design approaches and materials. CTE-matching and high thermal conductivity materials: Metallic, ceramic, and composite materials have been engineered to exhibit excellent thermal conductivity with controlled coefficient of thermal expansion (CTE) properties to allow for better matching with GaN, SiC, silicon, or ceramic materials to reduce thermal stresses in component packaging. Laird Performance Materials designs and develops electronic device protection solutions, including EMI suppression, thermal management materials, structural and precision metals, and multi-functional products. | Speakers will be asked to sign a permission to publish a statement. Manufacturers’ Representative Supporting the Illinois and Wisconsin Electronics Engineering and Manufacturing Community. Illinois 180 Crossen Ave Elk Grove Village, IL 60007. This will include cash stipends for winning graduate and undergraduate science and engineering student presentations. STEF is dedicated to worldwide educational opportunities and resources within the electronics thermal engineering community. We create advanced protection solutions for electronic components and systems. “We are excited to expand and strengthen our relationship with Laird,” said Alan Clapp, Vice President, Heilind Electronics. Are you sure you want to log out of your MyMouser account? ... Corporate headquarters and logistics center in Mansfield, Texas USA. When booking the event, please ensure that the Delegate Name is included on the booking form, if you are not the person attending. We solve design issues through innovative products such as EMI suppression or absorption materials, thermal interface materials, structural and precision metals, magnetic ceramic products, and multi-functional solutions. Copyright ©2020 Mouser Electronics, Inc. - A TTI and Berkshire Hathaway company. Excellent EMI shielding performance, electrically conductive fabric with a soft urethane foam core. Non-Members of IMAPS (including those only registered on IMAPS-UK website) will be charged a registration fee of £50 (exc VAT). Abstracts may be submitted to the general and program chairs. Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. Accessibility An abstract submittal page will also be available at a later date on the SEMI-THERM Educational Foundation website (www.semi-therm.org). Please note that the person booking the event will be the only person who will have access to event booking history and be able to download any event materials. 25novAll Day26THERMAL MANAGEMENT ONLINE CONFERENCE, Challenges and Solutions for Keeping Electronics Cool About Us | Subscribe | Advertise | Contribute | Contact UsCopyright © 2020 Lectrix®. Outstanding balance which reflects all unpaid changes due at this time per your selected payment method. Please visit these categories for more information on. Mouser® and Mouser Electronics® are trademarks of Mouser Electronics, Inc. in the U.S. and/or other countries. IMAPS-UK will hold an Online Conference on the afternoons of Wednesday 25 November and Thursday 26 November 2020 on the topic of Thermal Management, where you can learn about the latest developments in passive and active cooling, materials, measurement, and modeling to address the challenges of enhancing thermal dissipation from advanced electronics systems. Stacked-die packaging: Advanced packaging technologies, such as System-In-Package, Multi-chip modules, Multi-package modules, and stacked-die packaging provide significant opportunities for miniaturization and performance enhancements. Find solutions. In 2019, the Workshop moved to the Microsoft Corporation Conference Center on the Microsoft headquarters campus, near Seattle WA, allowing us to set a new attendance record and expand the number of technical exhibits, with an outstanding response from speakers and attendees. Sign up to receive the latest in thermal management techniques, news, and products delivered to your inbox. Heilind Electronics, a leading distributor of electronic components, announced today the signing of a global distribution agreement with Laird Performance Materials, a portfolio company of privately held Advent International. All Rights Reserved.Privacy Policy | Cookie Policy. Corporate headquarters and logistics center in Mansfield, Texas USA. ​. For further information, please contact IMAPS-UK Office. These technologies introduce significant thermal and interconnect challenges that must be balanced against those benefits and require continuing new developments in materials and solutions. Accepted presentations may be considered for subsequent publication with a full manuscript in the annual SEMI-THERM Symposium and on the SEMI-THERM Technical Library. High thermal conductivity, low thermal resistance, and high reliability.

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